Materials Preparation – Instruments


Laboratory for Electron and X-ray Instrumentation (LEXI)
AngstromSystem-s

Angstrom Engineering EvoVac Glovebox Evaporator

Nickname: EvoVacStatus: Operational

Angstrom Engineering EvoVac glovebox-integrated thermal and electron beam evaporator located in room 1301 of Calit2 is capable of depositing planar and nano/microstructured thin films of a wide range of materials, including metals, oxides, and organics. Sensitive materials and substrates can be stored, moved from process to process and tested without exposure to the room environment. Learn More…

Other materials preparation instruments include:

  • EMS 150T Sputter Coater
  • SBT Plasma Cleaner
  • SBT Dimpler
  • SBT Slow Speed Saw
  • SBT Grinder
  • SBT Polisher
  • Hot Plate
  • Optical Microscopes

Center for Transmission Electron Microscopy (CTEM)
Fischione Nanomill

Fischione Nanomill

Fischione’s Model 1040 NanoMill® TEM specimen preparation system is an excellent tool for creating the high-quality thin specimens needed for advanced transmission electron microscopy (TEM) imaging and analysis. It is ideal for both post-FIB (focused ion beam) processing and the enhancement of conventionally prepared specimens.

Location: 1121 Engineering Hall

Gatan Dimple Grinder II

Gatan Dimple Grinder II

The model 657 Dimple Grinder II from Gatan is a precision instrument used to produce circular dimples (spherical or flat-bottomed profile) in materials such as ceramics, semiconductors, metals, and combinations thereof. The principal application is in the preparation of transmission electron microscope (TEM) specimens. When specimens are mechanically dimpled prior to final thinning, the finished specimen has a more uniform thickness, has a larger than usual electron-transparent area, and is very robust with a thick rim surrounding the central thin region. In the case of a neutral particle, beam thinning systems, the time required for final thinning is significantly reduced with dimpling.

With most metals, a 20 μm specimen can be obtained by dimpling, and the mechanical damage introduced into the specimen surface by the grinding action is removed with additional final thinning by electropolishing, ion-beam thinning, etc. A final specimen thickness of <5 μm can routinely be produced by a careful operator.

Location: 1121 Engineering Hall

Gatan PIPSII

Gatan PIPS II Ion Mill

PIPS II is the latest version of the ion milling system and a powerful tool for TEM specimen preparation. It uses a focused Ar ion beam to precisely mill TEM samples until a small hole is created in their thinned area. The voltage can be tuned between 100 V-8kV. The low voltage ion beam is used for the final stage to get rid of the surface damage caused by high voltage ion beam. TEM samples prepared by FIB can be cleaned by PIPS II as well.

Location: 1121 Engineering Hall

Gatan Solarus Advanced Plasma Cleaning

Gatan Solarus Advanced Plasma Cleaning System

Optimal imaging and microanalysis in electron microscopy require a clean, well-prepared specimen. This is especially important for field emission gun transmission electron microscope (FEGTEM) because specimen contamination rates tend to increase as probe size decreases and beam current density increases. The high performance now possible with the field emission scanning electron microscope (FESEM) underscores the need for eliminating hydrocarbon contamination, especially for those applications involving low voltage, high-resolution operation.

An RF-generated gas plasma cleaning process, originating within the semiconductor industry for wafer cleaning, has been known and available for some time. A version of this technique was adapted for EM applications by Nestor Zaluzek at Argonne National Laboratory and University of Chicago (US Patent 5,510,624, dated April 23, 1996).

The Solarus® advanced plasma system, model 950, expands this process to a new level. Solarus is a low power hydrogen and oxygen radical generator producing glow discharge plasma within the generator housing. The hydrogen and oxygen radicals disperse from the generator by convection, passing over and around the specimen/specimen holder tip to clean hydrocarbons from the surfaces. The process produces H2O, CO2, and CO gases that are pumped away by the vacuum system.

Solarus incorporates a multi-stage diaphragm pump backing a turbomolecular drag pump to assure fast, reliable pumping. The pump package enables pump and vent cycles of less than two minutes. With cleaning times of 1 – 2 min, the full Solarus cleaning cycle takes less than 4 min.

Location: 1121 Engineering Hall

MultiPrep™ Polishing System

MultiPrep™ Polishing System

The Allied High Tech MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation.

Capabilities include parallel polishing, angle polishing, site-specific polishing, or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill.

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored in real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize the use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Location: 1121 Engineering Hall

Other materials preparation and supporting instruments include:

  • Leica Ultramicrotome (EM UC7 with cooling stage)
  • Leica Plunger (EM GP)
  • Leica Tissue Processor (EM TP)
  • Leica Sputter Coater ACE600 (high vacuum)
  • Leica Sputter Coater ACE200 (low vacuum)
  • Leica Critical Point Dryer (CPD 300)
  • Leica EM TXP (sawing and polishing system)
  • Gatan Disk Grinder
  • Gatan Disk Puncher
  • Gatan Specimen Mounting Plate
  • Eppendorf Centrifuge
  • Ultrasonic Cleaner
  • Thermo Scientific Precision Oven
  • National Vacuum Oven
  • LabRepCo Refrigerators/Freezers
  • Pelco Rotary Mixer

Materials Characterization Center (MC2)
  • Fischione 1010 Ion Mill
  • VG/Polaron SC 7620 Sputter Coater
  • SBT low-Speed Diamond Wheel Saw
  • SBT Slurry Disk Cutter
  • SBT 910 Polishing Machine
  • SBT 900 Grinder/Polisher
  • Ultrasonic cleaner
  • Metal and Carbon Thermal Evaporator
  • Struers Tenuupol-3 double-jet electro-polisher
  • South Bay Technology Ion Beam Sputtering/ Etching System (loaner)
  • Nikon Epiphot Reflected Light Optical Microscope
  • Nikon Optiphot -POL Transmitted Light Optical Microscope
  • Buehler Simplimet III Mounting Press
  • Buehler Ecomet III Variable-Speed Grinder-Polish
  • South Bay Technology Model 350 Coring Device
  • 2 Stereomicroscopes

TEMPR Lab
  • Flow hood
  • Refridgerator
  • Stirring hot plate
  • Oven
  • Mill-Q
  • Sonicator
  • Balance
  • Microbalance
  • Vortex mixer